FR4 Copper clad laminate is made of epoxy resin, high quality glass cloth and copper foil. It has excellent
heat resistance, good mechanical & electrical properties, high peel strength and chemical resistance,
Suitable for making flame resistant PCB of
high_grade electronic equipment, computers and other printed circuit boards that required high density and
excellent heat resistance.

Peel strength (35μm copper foil) : min 1.4 N/mm

immerse resistance288℃,20S:no change

Dielectric Voltage:≥40KV

Dielectric Constant (1MHz):≤5.4

GeneralProperties
TestItem		Unit	Condition	TypicalValue
				FR-4CCL
Surfaceresistivity	Afterdamp	MΩ	F	≥104
Volumeresistivity	Afterdamp	MΩ.cm	F	≥106
	Afterheattreatment		E-24/125	≥103
DielectricVoltage		KV	D-48/50+D-0.5/23	≥40
DielectricConstant(1MHz)			C-40/23/50	≤5.4
Peelstrength(35μmcopperfoil)		N/mm	A	≥1.40
Immerseresistance			288℃,20S	Nodelamination Non-foaming
			260℃,20S	--
Bendingstrength	Vertical	MPa	A	≥410
	Parel.		A	≥340
Waterabsorption		%	E-1/105+des+D-24/23	0.10-0.77≤0.80
				0.78-3.20≤0.35
Flammability			A&E-1/105+des	94V-0